FMS 2023: BIWIN brings the latest innovative storage solutions

FMS 2023: BIWIN Offers The Latest Innovative Storage Solutions: Integrated Computing Design

July 24, 2023

FMS 2023: BIWIN brings the latest innovative storage solutions

TO Flash Memory Summit 2023 At booth 619, BIWIN Storage Technology Co., Ltd. will showcase a wide range of embedded memory and industrial solutions designed to meet the growing global demand for memory and storage.

BIWIN’s innovative storage solutions will cover 2.5-inch SSDs, M.2 SSDs, BGA SSDs, Micro SD cards, onboard memory chips and DRAM modules. BIWIN will also showcase its integrated circuit packaging and testing services that enable customers to customize their own solutions.

Many of the popular INDUSTRIAL SOLUTIONS at BIWIN booth will be:

PCIe Gen4 SSD up to 4TB

AP860: Powered by BIWIN’s self-developed firmware, the AP860 delivers up to 7100MB/s sequential read and up to 6600MB/s sequential write using PCIe Gen4×4 and NVMe 1.4 interface. With a capacity of up to 4TB, it offers random read/write speeds of up to 1070,000 IOPS/980,000 IOPS, providing better responsiveness and smooth user experience. AP860 also adopts cost-effective DRAM-free solution and supports HMB to achieve maximum performance.

2.5″ wide temperature SSD

GS301: BIWIN GS301 achieves full sequential read speeds up to 540MB/s, greatly improving system responsiveness and avoiding stability issues. Wide temperature controller, quality NAND and 30 µ” gold finger PCB ensure the stable operation of the GS301 in the operating temperature range of -40 to 85.

BGA solid-state drive

EP400: With a capacity of up to 1TB, the EP400 PCIe Gen4 BGA SSD features high-speed PCIe 4.0 x 2 to deliver up to 3550MB/s reading and 3410MB/s writing, with a mini size of 11.5mm(L) x 13mm(W).

Wide temperature Micro SD card

TF200I: This BIWIN card features read/write speeds up to 160MB/s/120MB/s, supporting 4K RAW video recording. It also complies with the A2 standard for high app performance and improves the functioning of your devices. Built with quality 3D TLC NAND flash, this BIWIN Micro SD card offers 3,000 P/E cycles. It comes with at least 32GB of storage, up to 256GB.

Some of the popular EMBEDDED MEMORY CHIPS at BIWIN booth will be:

BIWIN and POP144 (available in different capacities) combines MMC and Mobile LPDDR in one package. With leading wafer packing technologies including wafer grinding, lamination and lead bonding, BIWIN integrates RAM and ROM into one device which improves performance while saving power. This combination also saves valuable printed circuit board (PCB) space; and shorten the product development period for customers. BIWIN ePOP products are small in size, low in energy consumption, low in cost, and easy to develop, making them ideal solutions for smart wearables, IoT devices, and portable and handheld devices (such as smartphones, tablets, PMPs, PDAs, and other multimedia devices).

BIWIN UFS3.1 it is available in 64GB, 128GB, 256GB and 512GB capacities, offering read and write speeds of up to 2100MB/s and 1200MB/s. It offers high capacities and blazing speeds in a slim form factor that’s ideal for mobile devices.

Here comes the DDR5 revolution

BIWIN DDR5 U-DIMM It is a high-performance, low-power consumption memory module that is fully compliant with JEDEC’s 288-pin DDR5. This series of products uses an operating voltage of 1.1V and can deal with ambient temperature ranges from 0 to 85. With DIMM capacities from 8GB to 32GB, the data transfer rate is up to 5600MT/s. The DRAM integrated circuits used in this series of products are rigorously selected to ensure stable operation and strong compatibility, making the products the best choice for industrial control, safety and security, desktop PCs and more.

BIWIN DDR5 SO-DIMM It is a low-power, high-performance product that fully complies with JEDEC’s 262-pin DDR5 small-size memory module. This series of products use a working voltage of 1.1V and their applicable operating temperature range is from 0 to 85. With a capacity range of 8GB to 32GB with data transfer rates up to 5600MT/s, DDR5 SO-DIMM fits computer and laptop for gaming, NUC, thin client, security and more.


BIWIN Storage Technology Company Limited manufactures high quality flash memory and is now known in the consumer, enterprise and industrial segments for its independent development capabilities of storage hardware, software, firmware and algorithms.

BIWIN’s expertise in manufacturing (along with its complete packaging, testing and production lines) ensures BIWIN’s products have superior performance, earning BIWIN many awards and a reputation for providing global customers with high-quality storage products.

The company recently opened its latest facility, the 110,000 m2 BIWIN Huizhou Science and Technology Campus, with a state-of-the-art R&D laboratory and a nearly tenfold increase in production capacity.

Our founders started their work in the flash storage industry in Shenzhen, China in 1995 by embracing their “WIN-WIN” business philosophy which would later become the hallmark of BIWIN. In 2009, they made a key decision for the company: to add the IC encapsulation process (or IC packaging) in the factory. This is a notable milestone that the vast majority of competing companies still don’t have (they either outsource the process or buy the packaged IC) and led to the creation in 2010 of the company we know today, BIWIN Storage Technology Company Limited.

BIWIN Storage Technology Company Limited (known as BIWIN in Stock Symbol: 688525) has successfully joined the Shanghai Stock Exchange, the STAR market, in the elite Sci-tech Innovation Board.

For more information about BIWIN technology, please visit

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